SDKY New Material Technology Co., Ltd

Innovation and R&D

Master the underlying technology of molecular structure of low-pressure injection molding polyamide materials.

- Master the underlying technology of molecular structure of low-pressure injection molding polyamide materials.

- Pioneered the development of low-pressure injection-molded polyamide materials with strong UV resistance that meet the requirements of 5G outdoor equipment.

- Pioneered the development of low-pressure injection molding polyamide materials suitable for high-cold environments and resistant to minus 65 degrees.

- Pioneered the development of low-pressure injection molding materials for wire threading and sealing of security camera equipment.

- Pioneered the development of low-water absorption, low-pressure injection molding materials for battery sealing.

- Pioneered the development of low-pressure injection molding polyamide materials that have good bonding properties with a variety of difficult-to-bond substrates.

- Continuously developing next-generation low-pressure injection packaging and protection materials.

- Providing sealing and protection solutions for electronic products, sensors, intelligent transportation devices, precision automotive harnesses, PCBA, chips, and other delicate devices.

Adhesive technology

- Optical fiber epoxy adhesive products and flexible epoxy products; successfully completed the laboratory development of hemodialysis medical polyurethane adhesives, pending application validation; successfully developed UV moisture-curing and a variety of dual-curing high-end adhesives; initiated the project to develop high-temperature resistant epoxy adhesives that are in short supply in the market.

- Develop and master the preparation technology of a series of high-performance thermal conductive adhesives.

- Develop and master the preparation technology of a series of high-performance structural adhesives.

- Develop and master the preparation technology of chip-level underfill adhesive.

- Develop and master the preparation technology of PCBA surface protective adhesive.

- Develop and master the preparation technology of multi material adhesive sealant.

- Develop and master the preparation technology of special medical equipment adhesive.

- Develop and master adhesive technology with multiple special requirements for high-end applications.

- Providing bonding and sealing protection solutions for industries such as 5G telecommunications, automotive (including new energy vehicles), smart manufacturing, rail transportation, aviation, and more.

Polyimide Materials Technology

- Polyimide (PEI) products have passed the mass production process review by a leading company in the aerospace industry, receiving domestic recognition as a pioneering product.