Underfill Adhesives
◇ Single-part, halogen free
◇ Reworkable
◇ Minimal encapsulating stress, excellent impact, moisture and heat aging resistance
◇ Underfill for CSP/BGA
Product | Color | Viscosity mPa.s | Density g/cm3 GB/T 13354 | Hardness Shore D ISO 868 | Tg ℃ ISO 11359-2 | CTE K-1 | Volume Resistivity Ω.cm IEC 60093 | |
| Pre Tg | Post Tg | |||||||
| ASTM D3386 | ||||||||
8310 | Black Liquid | 354 | 1.15 | 86 | 124 | 61×10-6 | 190×10-6 | — |
8331 | Black Liquid | 4000-7000 | 1.13 | 84 | 69 | 63×10-6 | 210×10-6 | 4.4×1016 |
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