PUR Hot Melt Adhesives
◇ Single-part, moisture cure PU adhesives
◇ High adhesion, high elongation at break
◇ Low temperature resistance，good sealing capability
◇ Mainly used for sealing and bonding of phone, PAD, laptop shells and frames
Product No. | Color | Viscosity mPa·s | Density g/cm3 GB/T 13354 | Open Time min φ1，25℃ | Hardness Shore D ISO 868 | Tensile Strength N/mm² ISO 527-3 | Tensile Shear Strength N/mm² | Temperature Range ℃ | |
PC/PC | Al.Mg/Al.Mg | ||||||||
3910 | White to Light Yellow | 3000～5000 | 1.1 | 3～10 | 30 | ≥8 | ≥7.5 | ≥4 | 110～120 |
3930 | White to Light Yellow | 2000～4000 | 1.1 | 3～10 | 30 | ≥8 | ≥7.5 | ≥4.5 | 105～120 |
3940 | Black | 2000～4000 | 1.1 | 3～8 | 30 | ≥8 | ≥8 | ≥4.5 | 105～120 |
CN
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