- Medium viscosity, black
- High glass transition temperature/Tg, high bonding strength
- Low temperature heat cure
- Used for assembling of memory cards,CCD/CMOS, fingerprint identification module
Low Temperature Epoxy Adhesive Properties Table
| Product | Color | Viscosity mPa·s | Density g/cm3 | Cure Condition | Tg ℃ | CTE K-1 | Shear Strength MPa | Storage Condition | |
| Tg前 | Tg后 | ||||||||
| 3190 | Black | 27750 | 1.3 | 1h@100℃ | 135 | 39 | -25~-15 | ||
| 3510 | Black | 7000～27000 | 1.6 | 20min@80℃ | 45 | 40×10-6 | 130×10-6 | 21 | -25~-15 |
| 3520 | Black | 10000-20000 | 1.45 | 5-10min@80℃ | 35 | 55×10-6 | 162×10-6 | ≥13 | -25~-15 |
| 3521 | White | 8~20 | 1.33 | 5min@80℃ | 51 | 18 | -25~-15 | ||
CN
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