- Good adhesion to various substrates;
- Excellent sealing properties along with outstanding physical and chemical performance;
- Offers insulation, waterproofing, dustproofing, impact resistance, vibration damping, and chemical corrosion resistance, providing effective protection for electronic components.
Typical applications:
- Suitable for protection of electronic device sensors, PCBA, and other electronic components;
- Waterproof sealing for connectors;
- Protection for wire harnesses;
- Packaging protection for automotive electronic devices and wire harnesses;
- Electronic detonator delay module packaging;
- CCTV camera tail wire water resistant enhancement;
- Battery packaging, etc.
Low Pressure molding process is a encapsulating process which the molten material is injected into the moldset through very low molding pressure and is molded with very quick cool speed. It can greatly help our customers to save comprehensive production costs through this process with Low pressure and low temperature molding, easy operation, very high productivity, and short cycle time and without damaging our electronic components.
Low pressure molding polyamide is a bio-based material with non-corrosive, no toxic, odorless and no VOC. Its flammability rating meets UL94-V0 standard.
Low Pressure Molding PA Properties Table
| Product | Color | Application Description | Hardness Shore ISO 868 | Softening Point ℃ ASTM E28 | Viscosity MPa·s ASTM D3236 | Elongation % ASTM D638 | Tensile Strength MPa ASTM D638 | Temp. Resistance ℃ |
| 8801/8801A | Black/Amber | High hardness，short open time，low molding temperature | 90A | 155 | 2500/170℃ | 4 | -20~110 | |
| 8806/8806A | Black/Amber | Excellent fluidity, low temperature toughness, wide application temperature range | 90A | 165 | 2500/200℃ | 400 | 4 | -40~105 |
| 8807/8807A | Black/Amber | Low temperature toughness, wide application temperature range | 90A | 162 | 5000/200℃ | 700 | 4 | -40~105 |
| 8808S/8808AS | Black/Amber | Good fluidity, excellent bonding performance | 88A | 165 | 3000/200℃ | 400 | 2.8 | -40~105 |
| 8832/8832A | Black/Amber | Universal, high hardness, good flexibility | 40D | 160 | 2500/210℃ | 650 | 7 | -40~110 |
| 8835/8835A | Black/Amber | High hardness, high temperature 150 ℃, can do appearance parts | 48D | 195 | 4500/220℃ | 500 | 12 | -25~150 |
| 8844/8844A | Black/Amber | Good bonding properties, low injection temperature | 86A | 144 | 4500/170℃ | 300 | 4 | -40~100 |
| 8845/8845A | Black/Amber | Good temperature resistance, good fluidity, can be injection molded under relatively low temperature conditions | 92A | 170 | 4000/195℃ | 800 | 5 | -40~125 |
| 8846/8846A | Black/Amber | High hardness, high strength, suitable for injection molding products of different sizes | 94A | 175 | 5500/210℃ | 800 | 8 | -40~130 |
| 8847/8847A | Black/Amber | High hardness, excellent fluidity | 93A | 180 | 2500/210℃ | 700 | 6 | -40~130 |
| 8848/8848A | Black/Amber | UV resistant, suitable for outdoor, suitable for injection molding products of different sizes | 94A | 175 | 6500/210℃ | 600 | 9 | -40~130 |
| 8854/8854A | Black/Amber | With low temperature toughness, excellent bonding performance | 73A | 162 | 5000/210℃ | 600 | 4.3 | -40~120 |
| 8863/8863A | Black/Amber | With low temperature toughness, wide application temperature range | 83A | 160 | 3000/200℃ | 600 | 4.8 | -40~120 |
| 8866/8866A | Black/Amber | Low water absorption, excellent insulation performance | 88A | 156 | 3800/190℃ | 500 | 4.5 | -40~110 |
| 8868/8868A | Black/Amber | Low water absorption, low injection temperature, good adhesion to various substrates | 27D | 140 | 2000/180℃ | 110 | 4 | -40~95 |
| 8878/8878A | Black/Amber | Good flexibility, high temperature resistance | 92A | 190 | 4500/210℃ | 500 | 4 | -40~140 |
| 8879/8879A | Black/Amber | Good flexibility, high temperature resistance, excellent fluidity | 88A | 190 | 2000/220℃ | 500 | 4 | -40~140 |
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