- Board level underfill
- Low viscosity, general-purpose
- Compatible with most lead-free solder materials, electrical properties stability
- Suitable for chip filling and BGA protection
Underfill Epoxy Adhesive Properties Table
| Product | Color | Viscosity mPa·s | Density g/cm3 | Hardness Shore | Tg℃ | CTE K-1 | |
| Pre Tg | Post Tg | ||||||
| 8308 | Black | 320 | 1.15 | 90D | 113 | 171 | 55 |
| 8313 | Black | 20000 | 1.55 | 86D | 120 | 15 | 70 |
CN
Return to List
