- Chip level underfill
- Low CTE, greatly reducing the stress on the packaging after curing
- Excellent shock, humidity and heat aging resistance
- Underfill for CSP/BGA and other packaging
Underfill Epoxy Adhesive Properties Table
| Product | Color | Viscosity mPa·s | Density g/cm3 | Hardness Shore | Tg℃ | CTE K-1 | |
| Pre Tg | Post Tg | ||||||
| 8308 | Black | 320 | 1.15 | 90D | 113 | 171 | 55 |
| 8313 | Black | 20000 | 1.55 | 86D | 120 | 15 | 70 |
CN
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