- Single-component, reworkable
- Phase change temperature 45°C,coefficient of thermal conductivity 3.4W/mK
- Good thermal conductive, dispensing, screen printing and manual applying
- Suitable for the heat conduction between heat sinks and heating devices, such as a microprocessor, GPU, IGBT, FBDIMM/internal memory etc.
Phase Change Thermal Conductive Material Properties Table
Product | Before Cure | After Cure | Phase Change Temperature ℃ DSC | |||||
Appearance | Viscosity mPa·s | Density g/cm³ | Density g/cm³ | Thermal Conductivity W/m·k | Volume Expansion Rate % | |||
1 rpm | 10 rpm | |||||||
8510 | White paste | 800000~1200000 | 500000~700000 | 1.8 | 2 | 1.7 | 15 | 45 |
8511 | White/grey half flowing | 800000~1200000 | 500000~700000 | 1.8 | 2 | 3.4 | 15 | 45 |